jtr1962
Flashaholic
My power LED test jig uses a ~7"x3"x2" U-channel of aluminum as a heatsink. As a result, slug temperature is probably fairly close to room temperature. Also, the room was at about 65°F when I tested. Given that, the die may well have been not much over 25°C at 350 mA. Using 8°C/W for the junction to solder point interface, and allowing perhaps 2°C/W for the thermal grease interface to my heat sink, I'm calculating a junction temperature of perhaps 30°C given a heat sink temperature of ~65°F. This means the output is only derated by 1 or 2% relative to a junction temperature of 25°C.NewBie said:Your testing on an actual part is still hitting CREE's claims even with the die not at 25C, very impressive.
Very nice, your P4 did even better than my P3:
I found it interesting that our efficiency numbers are close because Vf on your sample was less than on mine. I wonder if the higher binned XR-Es will have output which scales with Vf? If so, then they won't be substantially more efficient than the regular binned ones.
Another interesting thing here is that according to the light meter benchmark testing my meter reads about 10% low for an LED-type spectrum. Granted that the error will be different for different types of LEDs, but this could mean that my test sample was putting out as much as 8.5 lumens more than my test results show. Or perhaps the error in my meter just about cancels any errors resulting from my test methodology. I'm really surprised that all my tests of power LEDs have given the results they were supposed to. A SSC came out at almost exactly the typical 52 lumens it was supposed to. A Q-bin Luxeon was also practically dead center of where it should have been.